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Competence - Thermoselective Vacuum Encapsulation
If you always wanted to know how to fully encapsulate the entire electronics of power supplies, then you learn from the expert the best method to reach a "cemented joint" with the perfect encapsulation technology.
After years of extensive research and development, MTM Power leveraged the promising technology of the thermoselective vacuum encapsulation. A two component resin is being added to the electronics under vacuum at different temperatures, resulting in extremely robust, resistant and resilient MTM Power modules with longer life time. The high complex manufacturing process as well as the "recipe" of the potting compound are the result of a long and intensive research by MTM Power - worldwide unique and patented for the US market (U.S. Patent No. 8, 821, 778 B2).
The potting of the complete power supply electronics enables a compression of the packing density, confers the modules an extremely robust encapsulation and thus makes them resistant against shock and vibration, dirt, dust and humidity. Hence, further protective measures against aggressive environmental influences in harsh surroundings are no longer required.
Encapsulation Equipment
| Highest flexibility independent from case size and form |
| Optimising the potting process and minimising the cycle time by simultaneous movement of casting nozzles and module carrier |
| Infinitely adjustable inclination setting of the modules under the casting nozzles during the potting process |
| Maximum possible variability when loading the module carriers enables a high flexibility regarding changed production conditions |
Features Potting Compound
| Outstanding electrical isolation characteristics |
| Fire resistant characteristics acc. to UL94V-0 |
| Thermal conductivity, heat dissipation |
| Excellent flow characteristics enable the flowing around the compoments |
| Excellent adhesive properties on different substrates |
| Fast hardening of higher layer thickness |
Advantages of Our Vaccum Encapsulation Technology
- Solid insulation acc. to "cemented joint" test – no consideration of air and creepage distances
- Absolutely resistant against shock and vibration
- No impact of humidity and condensation
- No impact of conductive material of any kind
- ... For more information please click here
